Whitepaper: Piezo-Based Mechanisms in Micro-Hole Drilling Systems
Ultrafast lasers enable laser drilling with unprecedented precision, especially when creating microscopic holes in a variety of materials. These breakthroughs enable uniform hole formation using cold ablation, minimizing the need for extensive post-processing. This approach is becoming increasingly important in a wide range of applications, including cooling aerospace components, fuel injectors, inkjet printer heads, and forming microvias in circuit boards.
Motion control plays an important role in the drilling process. System designers have the flexibility to choose from a variety of motors, scanners and controllers and decide whether to use the laser or the material being machined during the drilling process. Furthermore, there is the possibility of simultaneously repositioning both the laser and the sample, which requires seamless communication between the various components within the positioning setup.
Our laser drilling white paper reviews various control techniques and provides insight into a new piezo nanopositioning scanning stage-based solution that can achieve unprecedented accuracy and throughput.


