Demonstrators for a Variety of Application Requirements

Every market and every application requires different things from positioning solutions, for example, with regard to precision, dynamics, travel ranges, control, or software. Due to its wide-ranging technology and product portfolio, PI can respond to individual requirements, as well as combine solutions flexibly - from individual components through to multi-axis system assemblies. This page presents different examples of our application-specific demonstrators, which we can configure and assemble to meet your specific requirements.

Laser Materials Processing such as Cutting, Drilling, Micromachining, and Laser Welding

Seam Sealing of Electronic Packages Using Pulsed Laser Sources To protect sensitive electronic components from contaminants seeping in and to ensure safe and reliable operation, the components’ housing must be sealed hermetically. Using a laser source as a tool provides high welding speeds and produces fine welding seams with narrow welding radiuses.

Laser Seam Welding of Electronic Packages Using Galvo Scanners For the safe and reliable operation of sensitive electronic components or assemblies, the components’ housing must be sealed hermetically to protect the microsystem from damage caused by contaminants seeping in. Using lasers for seam formation enables high welding speeds, as well as fine welding seams with narrow welding radiuses.

Laser Drilling of High-Density Micro Holes When laser drilling the smallest high-density holes, many factors such as cone shape control as well as spot size and wavelength of the laser will have an impact on the result. In addition, fast and precise positioning of the workpiece, the laser head and the laser focus height is important.

Wafer Stealth Dicing In the production of chips and microchips, it is necessary to separate the individual dies from the wafer. In this process, quality and precision are crucial for all further post-fab operations. Laser dicing has therefore become the preferred dicing technology.

Laser Processing of High-Density Structures over Large Areas The processing of high-density structures over large areas such as laser drilling or laser marking of PCBs requires solutions that provide high precision and high throughput. The combination of multi-axis positioning systems with a highly dynamic galvanometer scanner can address the needs of industrial production.

Scalable Solution for Industrial Laser Processing Integrated multi-axis platform solution improving implementation and performance of precision automation in laser materials processing such laser drilling, laser cutting and laser micromachining.

Industrial Laser Material Processing Machining platforms for creating tiny geometries in the micron range demand motion systems that provide a consistent, accurate and dynamic processing in multiple dimensions.

High-Precision Laser Processing for Wafer Dicing Manufacturing chips and microchips involves cutting the wafers, using a process known as wafer dicing, into small square or rectangular “chips” or “die”. Typical challenges to consider in wafer dicing applications are: To position the cut accurately, to minimize the losses of material, and to minimize distortions of the components.

Hermetic Sealing of Electronic Components Using Laser Welding When confronted with health problems, medical technology today makes it possible for implants, for example pacemakers or insulin pumps, to perform important functions. Such implants are highly complex systems consisting of electrical and electronic components. Hermetic sealing, which keeps the microsystem and the surrounding tissue reliably separated from each other, is necessary for safe and...

High Dynamics Focus Shift for Laser Beam Welding and Cutting Lasers are used today in a wide variety of industrial applications in order to further optimize production processes and guarantee high workpiece quality. Laser machining processes can as well be significantly improved by high-frequency oscillation of the laser beam in the XY plane.

Tactile and Non-contact Inspection and Testing, Microscopy

Wafer and Substrate Inspection Wafer inspection is becoming more demanding, challenging, and costly due to the decreasing sizes of features and the complexity of the design. Step-by-step scanning for defect inspection enables semiconductor manufacturers to prevent yield losses by detecting defects in an early stage, and thereby reducing costs.

Wafer Inspection and Metrology The entire chip manufacturing process consists of 400 to 800 production steps. At all critical points in the manufacturing process, inspection processes are essential to ensure the high quality and reliability of the final products.

Tactile and Optical Testing of Electronic Devices Electronic devices are becoming smaller, more complex, operate in different environments, and include several types of components that require tactile, optical, and electronic testing methods.

Industrial Optical Inspection Optical inspection is an essential process in industrial quality assurance. Optical inspection systems, which are used in industrial environments, should provide reliable and repeatable measurement results and enable high throughput rates.

Nanopositioning for Microscopy Precision positioning is the key element in all types of microscopy. High-resolution microscopy must be capable of accurate and reproducible positioning of imaging elements and samples.

Motion Simulation for Qualifying Gyroscopes Gyroscopic instruments, i.e. Gyroscopes, can detect and measure a rotary motion or acceleration of the external reference system in relation to the rotating mass. For example, built into theodolites they are used for precise measurements in geodesy, mining, or geology. Due to their properties, gyroscopes are also used for active attitude control in aerospace and marine applications.

Motion Simulation for Testing Image Stabilization Taking sharp pictures despite poor lighting conditions, taking snapshots without blurring, recognizing traffic signs or road markings in driver assistance systems, or identifying dangerous situations in surveillance systems - all of this is possible today with the help of modern cameras. But how good is the still and video image quality of a camera or smartphone?

3D Profiling of Small Components and Features Fast and reliable measurement of the surface profile of smallest components and features places high demands on the motion and control systems as well as on the sensor technology to ensure that the end products meet the requirements regarding functionality and quality.

Manufacturing of Photonic Integrated Circuits (PICs) – Pick-and-Place, Assembling, and Testing

Assembly and Packaging of Photonic Devices Modern passive optical networks (PON) rely on optical components that can split or combine light signals coming from high-power light sources. Replacing active components with passive components provides significant cost savings by eliminating the need to power and service active components in the transmission loop.

Characterization of Light Emitting Devices The classic application focus of Optical Coherence Tomography (OCT) is the medical field of ophthalmology. However, today, OCT also gets considered for applications in industrial environments such as printed circuit board (PCB) layer diagnostics, and material surface analysis.

Automated Multi-Channel Fiber Array Alignment The setup for multi-channel automated fiber assembly, based on the proven double-sided F-712.HA2 fiber alignment system and PI´s multi-axis gantry system, offers an idea for further workflow automation.

Study: Fiber Alignment in Two Linear Axes Controlled by ACS PI’s optimization technology has proven to dramatically improve production economics in processes as diverse as photonics wafer probing, device packaging, chip testing, and even laser and optical equipment manufacturing. The combination of blazing speed, nanoscale performance, and industrial robustness reduces costs and improves yield worldwide.

Test and Assembly of Photonic Devices Integrating photonic structures or elements such as waveguides, photodiodes, lasers, and multiplexers presents a variety of demanding challenges to test and assembly processes, starting at wafer level through to final packaging.

Wafer Probing and Photonics Testing at Production-Level Silicon photonics plays a crucial role in the advancement of cutting-edge technologies such as quantum computing, nanosatellites, light detection and ranging (LIDAR), or optical logic, as well as in improving data processing, storage, and transmission.

Alignment of Optical Fibers and Photonic Devices As the global reliance on photonics grows, the industry demands new solutions for testing and assembly. PI provides high-end alignment systems for applications where throughput is key, as well as affordable alignment engines based on modular precision positioning stages.

High-Precision Piezo-Based Mirror Tilting, Lens Alignment in Six Degrees of Freedom, and Nanometer Precision Distance Adjustment

Free Space Optical Communication The S-355 tip/tilt platform is versatile in use thanks to its parallel-kinematic, multi-axis design and its flexure guides, which are free of maintenance, friction, and wear. It allows fast, high-dynamics motion with high precision.

Object Positioning in Six Degrees of Freedom Performing object movements in all six degrees of freedom is necessary in many applications. The compact, parallel-kinematic P-616KLTS NanoCube serves all six degrees of freedom and opens up many new possibilities for the assembly and adjustment of demanding structures.

Medical Technology

Incisionless Surgery Using Therapeutic Ultrasound

In the Virtual Trade Fair Video, Our Piezo Experts Bridge the Gap from Product to Application

PI piezo expert and Market Segment Manager MedTech Annemarie Oesterle explains why new and disruptive medical applications are best driven by ultrasonic transducers. Piezoelectric actuators generate HIFU, high-intensity focused ultrasound, enabling contactless treatment and incisionless surgery.

Contactless Patient Monitoring With Ultrasound

In the Virtual Trade Fair Video, Our Piezo Experts Bridge the Gap from Product to Application

PI piezo expert and Market Segment Manager MedTech Annemarie Oesterle explains why piezo-based ultrasonic transducers are ideal for patient monitoring applications. Flow measurement and air bubble detection, for example in infusion systems, pharmaceutic devices or spirometry, call for compact and extremely durable piezoelectric sensors.

Ultrafast Liquid Handling in Small Spaces

In the Virtual Trade Fair Video, Our Piezo Experts Bridge the Gap from Product to Application

PI piezo expert and Market Segment Manager MedTech Annemarie Oesterle explains why piezo-based ultrasonic transducers are ideal for challenges in IvD and liquid handling processes. Applications such as cell sorting, array spotting, or mixing tasks call for high speed and utmost precision.

Miniaturized Tools for Minimally Invasive Medical Procedures

In the Virtual Trade Fair Video, Our Piezo Experts Bridge the Gap from Product to Application

PI piezo expert and Head of Sales Dirk Roessger explains why miniaturized piezo elements are ideal for minimally invasive medical appliances. Applications bringing ultrasound to specific areas within the body, e.g. fiber scanning endoscopy, intravascular lithotripsy or therapeutic ultrasound, call for tiniest piezo components to make treatment faster, more powerful and more patient-friendly.

Ultrasonic Applications

Smart Metering for Intelligent Data Acquisition

In the Virtual Trade Fair Video, Our Piezo Experts Bridge the Gap from Product to Application

PI piezo expert and Head of Sales Dirk Roessger explains why piezo solutions are ideal for smart metering tasks. Smart metering applications such as flow metering, air bubble detection or level detection call for piezo elements to ensure a contactless and thus contamination-free process.

Ultrasound for Industrial Automation

In the Virtual Trade Fair Video, Our Piezo Experts Bridge the Gap from Product to Application

PI piezo expert and Field & Technical Sales Engineer Alexander Conrad explains why piezo-based ultrasound transducers are perfekt for industrial applications. Object recognition, structural monitoring, distance and acceleration measurement all benefit from the advantages of piezo technology.

Hydroacoustics in Underwater Communication

In the Virtual Trade Fair Video, Our Piezo Experts Bridge the Gap from Product to Application

PI piezo expert and Field & Technical Sales Engineer Alexander Conrad explains why piezo elements are popular for underwater communication. Object detection under water, scanning the bottom of the sea or control of marine systems can all benefit from piezo technology.

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